ECE – Electrical and Computer Engineering
ECE 210 INTRODUCTION TO ELECTRIC CIRCUITS (3-0-3)(F,S). Fundamental laws, basic network analysis, and circuit theorems. Capacitors, inductors, and operational-amplifier circuits. First- and second-order circuits. Sinusoidal steady-state analysis of AC circuits. Introduction to computer-aided circuit simulation. PREREQ: ENGR 120. PRE/COREQ: MATH 333.
ECE 212 CIRCUIT ANALYSIS AND DESIGN (3-0-3)(F,S). Single-phase and three-phase AC circuits. Mutual inductance and transformers. Laplace transforms and circuit applications. Transfer functions, Bode plots, frequency response, and resonant circuits. Fourier series and filter circuit design. Two-port networks. PREREQ: ECE 210 and MATH 333.
ECE 212L CIRCUIT ANALYSIS AND DESIGN LAB (0-3-1)(F,S). Lab work to accompany ECE 212 Circuit Analysis and Design. COREQ: ECE 212.
ECE 230 DIGITAL SYSTEMS (3-0-3)(F/S). Number systems, Boolean algebra, logic gates, Karnaugh maps, combinatorial circuits, flip-flops, registers, counters, sequential state-machines and introduction to Hardware Description Languages (HDL). Construction of small digital systems. PREREQ: COMPSCI 117 or COMPSCI 125. COREQ: ECE 230L.
ECE 230L DIGITAL SYSTEMS LAB (0-3-1)(F/S). Design, construction, and test of small digital logic circuits using TTL and CMOS chips. Use of FPGA-based prototyping boards with schematic capture and simulation. COREQ: ECE 230.
ECE 288 SOPHOMORE OUTCOME ASSESSMENT (0-0-0)(F,S). Competency based examination to assess students ability in mathematics (calculus and differential equations), sophomore physics, college chemistry, computer programming, electrical circuits, digital systems and ethics. Required for admission to upper-division ECE curriculum.
ECE 300 ELECTROMAGNETIC THEORY (3-0-3)(F). Electrostatic fields, potentials, Gauss’ law, solutions of Laplace’s equation, electrostatics of conductors and dielectric materials, vector potentials, Maxwell’s equations, and electromagnetic radiation. PREREQ: MATH 275, MATH 333 and PHYS 212.
ECE 310 MICROELECTRONIC CIRCUITS (3-0-3)(F/S). Circuit design and analysis using diodes, bipolar junction transistors, and MOSFETs. Introduction to design with op-amps. Circuit simulation with SPICE. PREREQ: ECE 212 and ECE 288.
ECE 310L MICROELECTRONIC CIRCUITS LAB (0-3-1)(F/S). Hands-on design, construction, and test of electronic circuits using signal generators, power supplies, and oscilloscopes. COREQ: ECE 310.
ECE 320 SEMICONDUCTOR DEVICES (3-0-3)(S).Fundamentals of solid-state electronic devices. Energy band theory, drift, diffusion, generation and recombination of carriers. Physics, modeling, and biasing of diodes, MOSFETs, BJTs. Electronics of metal-semiconductor junctions and the MOS capacitor structure. SPICE model development. Introduction to 2-D device design software. PREREQ:ECE 310.
ECE 320L DEVICE CHARACTERIZATION LAB (0-3-1)(S). Measurement of PN junction, BJT, and MOSFET I-V and C-V characteristics by on-wafer probing. SPICE model parameter extraction. COREQ: ECE 320.
ECE 330 MICROPROCESSORS (3-0-3)(F/S). Microprocessor architecture, software development tools, and hardware interfacing. Emphasis is placed on 16 and 32 bit microprocessor systems. Machine and assembly language programming, instruction set, addressing modes, programming techniques, memory systems, I/O interfacing, and interrupt handling are among the topics studied with practical applications in data acquisition, control, and interfacing. PREREQ: ECE 230.
ECE 330L MICROPROCESSORS LAB (0-3-1)(F/S). Lab work on microprocessors using a Macroassembler and a hardware experimentation kit. COREQ: ECE 330.
ECE 340 (MSE 310) ELECTRICAL PROPERTIES OF MATERIALS (3-0-3)(F). Physical principles underlying the electrical properties of metals, insulators and semiconductors. The effects of energy band structure, thermal properties and impurities on electrical conduction. Concepts covered are applied to electrical devices including nanodevices, MOSFETs and optoelectronic devices. May be taken for ECE or MSE credit, but not both. PREREQ: ENGR 245, MATH 333 and PHYS 309 or ECE 212.
ECE 350 SIGNALS AND SYSTEMS (3-0-3)(F/S). Signal and system properties. Fourier transforms. Basics of amplitude modulation. Sampling and aliasing. Z-transforms and digital filters. Nondeterministic signals. PREREQ: ECE 212, ECE 288, COREQ: MATH 360 or MATH 361, ECE 350L.
ECE 350L SIGNALS AND SYSTEMS LAB (0-3-1)(F/S). Lab work on signals and systems. COREQ: ECE 350.
ECE 360 (ME 360) SYSTEM MODELING AND CONTROL (3-0-3)(F/S). Modeling and simulation of physical systems. Transfer functions, block diagrams, and signal-flow graphs. State-variable analysis of linear systems and stability. Steady-state and transient specifications. Root locus technique. Design of feedback control systems. May be taken for ECE or ME credit, but not both. PREREQ: (ECE 212 and ECE 288) or (ENGR 220 and ENGR 240).
ECE 370 INDUSTRIAL POWER DISTRIBUTION (3-0-3)(S). Codes and standards, three-phase and single-phase system planning and design, voltage considerations, equipment protection, grounding design, power switching and motor control, lighting design, substation design, PLC system architecture design, and programming, equipment specification, construction drawings and specifications. PREREQ: ECE 212 or PERM/INST.
ECE 380 ELECTRICAL ENGINEERING PRACTICE (2-0-2)(S)(CID). Fundamentals in the practice of Electrical Engineering as a profession. Topics include written and oral communication within Electrical Engineering; engineering project management and economics; design of experiment, systems, processes, and devices; test, reliability, lifetime, and failure analysis; manufacturing; ethics; sustainability; and engineering professionalism. PREREQ: ENGL 202, ECE 212, ECE 288.
ECE 380L ELECTRICAL ENGINEERING PRACTICE LAB (0-3-1)(S)(CID). Laboratory work on Electrical Engineering Practice. COREQ: ECE 380
ECE 400 APPLIED ELECTROMAGNETICS (3-0-3)(S). An applied study of electromagnetic theory and its applications to wave propagation in bounded structures, scattering and diffraction, antenna theory, S-parameters, and microwave engineering. PREREQ: ECE 300 or PHYS 382.
ECE 410 INTEGRATED CIRCUIT PHYSICAL DESIGN (3-0-3)(F). CMOS IC layout, modeling, parasitic capacitance extraction, SPICE simulation. Design of static and dynamic logic gates, counters, registers, memories. Students will produce a verified layout file that can be used to build a set of photomasks for fabrication in either a foundry or in ECE 440. PREREQ: ECE 310.
ECE 410L MOSIS CHIP EVALUATION (0-3-1)(F). Laboratory to evaluate the CMOS integrated circuit chips designed in ECE 410 and fabricated through MOSIS (metal-oxide- semiconductor implementation system). PREREQ: ECE 410.
ECE 411 CMOS ANALOG IC DESIGN (3-0-3)(F/S). Design, layout, and simulation of CMOS analog integrated circuits. Current mirrors, voltage and current references, amplifiers, and op-amps. PREREQ: ECE 310, ECE 410.
ECE 413 RF DESIGN (3-0-3)(S). Design of wireless systems and RF circuits including amplifiers, oscillators, mixers, filters, and matching networks. Comparison of semiconductor device type characteristics and applications. Use of various analysis, simulation, characterization, and measurement tools for low-noise design, stability analysis, distortion analysis and mitigation, frequency synthesis, and transmission line characterization. PREREQ: ECE 300 and ECE 310.
ECE 418 MEMORY CIRCUIT DESIGN (3-0-3)(F)(Alternate years). Transistor level design of memory circuits. Memory technologies including DRAM, Flash, MRAM, Glass-based, and SRAM will be discussed. Practical introduction to the design of memory circuits. PREREQ: ECE 410.
ECE 420 ADVANCED DEVICE DESIGN AND SIMULATION (3-0-3)(F/S). MOSFET device physics, scaling rules, analytical short channel models, hot-electron effects/modeling, LDD design, gate oxide breakdown and reliability, TDDB, GIDL, channel mobility, electromigration, BSIM3 device modeling, 2-D TCAD device simulation. PREREQ: ECE 320.
ECE 420L ADVANCED DEVICE CHARACTERIZATION LAB (0-3-1)(F/S). Advanced measurement and parameter extraction techniques for MOSFETs. High frequency CV, Quasistatic CV, Charge-Pumping measurements. COREQ: ECE 420.
ECE 421 ADVANCED SEMICONDUCTOR DEVICES (3-0-3)(F/S). Study of advanced semiconductor devices, particularly photonic, microwave, power, and high temperature/radiation resistant devices, including physics and applications. TCAD simulation and modeling of these devices will be included. PREREQ: ECE 420.
ECE 422 MICROWAVE SEMICONDUCTOR DEVICES (3-0-3)(F/S). Covers the various aspects of design, fabrication, and characterization of ultra-low-power, RF-CMOS devices, on-wafer microwave measurement techniques and calibration techniques, short-channel CMOS device physics, parasitic CMOS device elements, advanced small-signal build and SOI RF-CMOS device models, and s-parameter device evaluation methods. PREREQ: ECE 420.
ECE 430 DIGITAL HARDWARE DESIGN (3-0-3)(F/S). Advanced topics in digital system design emphasizing the specification and design of complex digital hardware systems. Applications include design of synchronous state machines, asynchronous digital systems, and simple digital control circuits using hardware descriptive languages for field programmable gate arrays and complex programmable logic. PREREQ: ECE 230, COMPSCI 117 or COMPSCI 125.
ECE 430L DIGITAL HARDWARE DESIGN LAB (0-3-1)(F/S). Lab work using UNIX-based CAD tools for hardware design of digital systems employing FPGAs and CPLDs. COREQ: ECE 430.
ECE 432 (COMPSCI 441) COMPUTER ARCHITECTURE (3-0-3)(S). Structure of computer systems using processors, memories, input/output (I/O) devices as building blocks. Computer system instruction set design and implementation, including memory hierarchies, microprogramming, pipelining and multiprocessors. Issues and trade-offs involved in the design of computer system architectures with respect to the design of instruction sets. Applications of Hardware Description Languages (HDL) in the design of computer systems. May be taken for either COMPSCI or ECE credit, but not both. PREREQ: COMPSCI 117 or COMPSCI 125, and ECE 330 or PERM/INST.
ECE 433 EMBEDDED AND PORTABLE COMPUTING SYSTEMS (3-0-3)(F/S). Comparison of commercially available microcontrollers and their use in embedded communications and control applications. Power consumption, software development, interprocessor communication, and interfacing with sensors, actuators, and input/output devices. Use of microcontroller cores implemented in programmable logic devices as an alternative to hardwired microcontrollers. An embedded system project is designed and built. PREREQ: ECE 330.
ECE 434 COMPUTER NETWORKS (3-0-3)(F/S). Concepts of computer networks and architectures. Network topology, connectivity analysis, delay analysis, local access design. Physical layer, data link layer, higher layer protocols. Study of networks as distributed embedded systems. Routing, flow control, congestion control. Local area networks. PREREQ: ECE 330.
ECE 436 DIGITAL SYSTEMS RAPID PROTOTYPING (3-0-3)(S). Hardware description languages and hardware programming languages as a practical means to simulate/implement hybrid sequential and combinational systems. Actual design and implementation of sizeable digital design problems using the most up-to-date industry Computer Aided Design tools and Field-Programmable Gate Arrays. PREREQ: ECE 430 or PERM/INST.
ECE 440 INTRO TO INTEGRATED CIRCUIT PROCESSING (3-0-3)(F). Fundamentals of integrated circuit fabrication technology; semiconductor substrates; theory of unit processes such as diffusion, oxidation, ion implantation, rapid thermal processing, photolithography, wet etching and cleaning, dry etching, thin-film deposition; chemical mechanical polishing; process integration; metrology; statistical process control; TCAD. PREREQ: ECE 320 or ECE 340/MSE 310. COREQ: ECE 440L.
ECE 440L INTRO TO INTEGRATED CIRCUIT PROCESSING LAB (0-3-1)(F). Semiconductor cleanroom practices; heavy lab safety; students will experiment with semiconductor processes and fabricate and test simple structures in lab. COREQ: ECE 440.
ECE 441 ADVANCED SILICON TECHNOLOGY (3-0-3)(S). Advanced models for unit processes such as diffusion, oxidation, ion implantation, thin film deposition, etching, rapid thermal processing, chemical mechanical polishing, and lithography. CMOS, bipolar, and micro-electromechanical systems (MEMS) process integration. Process and device modeling using TCAD. PREREQ: ECE 440.
ECE 442 PHOTOLITHOGRAPHY (3-0-3)(F/S). Principles of optics, diffraction, interference, superposition of waves, imaging systems, fundamentals of microlithography, resolution, contact and projection lithography, photoresist processing, metrology. Phase shift masks, anti-reflective coatings, deep-ultraviolet lithography, off-axis annular illumination. Use of TCAD lithography simulation software.
ECE 442L PHOTOLITHOGRAPHY LAB (0-3-1)(F/S). Cleanroom lab experience accompanying ECE 442, utilizing a projection-printing wafer stepper, photoresist wafer track, SEM, and optical metrology equipment. Use of TCAD lithography simulation software. PREREQ: ECE 342. COREQ: ECE 442.
ECE 443 INTRODUCTION TO MEMS (3-0-3)(F/S). Overview of MEMS; MEMS device physics including beam theory, electrostatic actuation, capacitive and piezoresistive sensing, thermal sensors and actuators; basic MEMS fabrication techniques; MEMS technologies: bulk micromachining, surface micromachining, and LIGA; MEMS design and modeling; case studies in various MEMS systems. PREREQ: ECE 440 or PERM/INST.
ECE 451 COMMUNICATION SYSTEMS (3-0-3)(F). Signals, noise, propagation and protocol in analog and digital communication systems. Bandwidth, Fourier transforms, signal to noise ratio and receiver noise figures. Introduction to modern wireless communication systems such as cellular, wireless data and satellite data systems. PREREQ: ECE 350, and MATH 360 or MATH 361.
ECE 451L COMMUNICATION SYSTEMS LAB (0-3-1)(F). Lab experience accompanying ECE 451 utilizing AM/FM modulation, spectrum analysis, receiver design and analysis. PREREQ: ECE 350. COREQ: ECE 451.
ECE 452 WIRELESS COMMUNICATIONS (3-0-3)(F/S). Modern cellular communication systems, including propagation, handoff, noise, and interference studies. CDMA and other spread-spectrum systems. PREREQ: ECE 451.
ECE 454 DIGITAL SIGNAL PROCESSING (3-0-3)(F/S). Modern digital signal processing in engineering systems. Review of continuous-time and discrete-time signals, spectral analysis; design of FIR and IIR digital filters. Fast Fourier Transform, two-dimensional signals, realization structure of digital filters, and filter design. PREREQ: ECE 350.
ECE 456 PATTERN RECOGNITION (3-0-3)(S)(Alternate years). Basic concepts of statistical and neural pattern recognition. Structure of pattern classification problems. Mathematics of statistical decision theory; multivariate probability functions, discriminant, parametric and nonparametric techniques. Bayesian and maximum likelihood estimation, feature selection, dimensionality reduction, neural network recognition and clustering. PREREQ: COMPSCI 225, and either MATH 360 or MATH 361.
ECE 457 DIGITAL IMAGE PROCESSING (3-0-3)(F). Pictures and their computer representation. Image digitization, transformation, and prediction methods. Digital enhancement techniques, histogram equalization, restoration, filtering and edge detection. Color models and transformations. Wavelets and morphological algorithms. PREREQ: ECE 350 and COMPSCI 125, or PERM/INST.
ECE 461 (ME 461) CONTROL SYSTEMS (3-0-3)(S). Time and frequency domain analysis and design of feedback systems using classical and state space methods. Observability, controllability, pole placement, observers, and discrete time. Multivariable and optimal methods are introduced. May be taken for ECE or ME credit, but not both. PREREQ: ECE 360 or ME 360.
ECE 464 ROBOTICS AND AUTOMATED SYSTEMS (3-0-3)(F/S). An introduction to robotics with emphasis on automated systems applications. Topics include: basic components of robotic systems; selection of coordinate frames; homogeneous transformations; solutions to kinematic equations; velocity and force/torque manipulator dynamics; digital simulation of manipulator motion; motion planning; actuators of robots; sensors of robots; obstacle avoidance; and control design. PREREQ: ECE 360.
ECE 470 ELECTRIC MACHINES (3-0-3)(F). Magnetic materials and magnetic circuits. Principles of electromechanical energy conversion, energy and coenergy concepts, forces and torques of electromagnetic origin. Introduction to rotating machines including synchronous machines and induction machines. PREREQ: ECE 212, ECE 300.
ECE 470L ELECTRIC MACHINES LAB (0-3-1)(F). Lab work on electric machines. COREQ: ECE 470.
ECE 472 POWER ELECTRONICS (3-0-3)(F). Power electronic switches, diode and controlled rectifiers, AC-AC phase control, DC-DC converters, inverters, introduction to electric drives and power quality fundamentals. PREREQ: ECE 212.
ECE 472L POWER ELECTRONICS LAB (0-3-1)(F). Lab work on power electronic circuits and devices. COREQ: ECE 472.
ECE 473 POWER SYSTEM ANALYSIS I (3-0-3)(F). Three-phase AC systems, generators, transformers, transmission lines, one-line diagrams, perunit system, network calculations, load flow studies, power system operation. PREREQ: ECE 212. COREQ: ECE 300.
ECE 474 POWER SYSTEM ANALYSIS II (3-0-3)(S). Fault analysis, symmetrical components, power system transients, protection and relaying, transient stability, power system operation and control, power system economics, power quality, and power system reliability. PREREQ: ECE 473.
ECE 480 SENIOR DESIGN PROJECT I (2-3-3)(F). Part one of the capstone design experience integrating previous design work with design theory and methodology. Applied through individual projects with fixed specifications requiring effective use of engineering skills including: time management, design trade-off analysis, SPICE simulation, PCB layout, and test/debug of the constructed design. Written reports are completed at each phase of the design process. PREREQ: ECE 310, ECE 330, and ECE 350.
ECE 482 SENIOR DESIGN PROJECT II (2-3-3)(S)(FF). Part two of the capstone design experience integrating previous design work with design theory and methodology. Applied through group project to integrate specifications based upon customer and engineering requirements, computer modeling, simulation, and reliability analysis. Includes a series of project reports, formal presentations, and a written report. Development of skills used in the engineering profession: teamwork, effective meetings, safety, ethics, project management, and time management. PREREQ: ECE 480.